ELT 235

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COURSE SYLLABUS

1.	TITLE OF COURSE:	SEMICONDUCTOR MANUFACTURING I
	PREFIX/NUMBER:	ELT 235	CREDIT HOURS:	3.0
2.	PREREQUISITE:	ELT 134, ELT 147, PHY 105

3.	RESOURCES NEEDED:
	TEXT:	Microchip Fabrication: A Practical Guide to Semiconductor Processing. Peter Van Zant, Third Edition
	SUPPLIES:	Scientific calculator, clean room garments, notebook, 3 ½ HD floppy diskettes, and pencil
4.	COURSE DESCRIPTION:	The first course in a two-course capstone sequence in semiconductor processing. Covers tracing semiconductor processing from raw materials to a finished integrated circuit, semiconductor device physics and the following manufacturing processes: oxidation, mask design, photolithography, and etch.
5.	COURSE GOAL:	The student will demonstrate the use of equipment sequence in the following semiconductor manufacturing processes. Tracing semiconductor processing from raw materials to a finished integrated circuit, semiconductor device physics and the following manufacturing processes: oxidation, mask design, photolithography, and etch.

6.	COURSE OBJECTIVES:
	After completion of this course the student will be able to:
	1.	Describe the major steps in the semiconductor assembly process. (I)
	2.	Describe the alignment and exposure process including development and inspection. (II)
	3.	Describe the purpose and parameters of annealing. (III)
	4.	List eight sources of contamination as well as methods of detection and control. (IV)
	5.	Describe the differences between various crystal structures. (V)
	6.	Describe the chemical vapor deposition process. (VI)
	7.	Contrast Bipolar and MOS transistors. (VII)
	8.	List the five steps of diffusion. (VII)
	9.	Describe the process of etching, including wet and dry etching, stripping, and after-cleaning inspection. (IX)
	10.	Explain electron bonding between silicon and oxygen. (X)
	11.	Contrast transistors, diodes, capacitors, and resistors. (XI)
	12.	Describe the purposes of the epitaxial layer, the steps of its growth, and characteristics used to evaluate it. (XII)
	13.	Explain the purpose, process, and effect of ion implantation. (XIII)
	14.	Define regions and functions and their electrical functions. (XIV)
	15.	Describe metalization, including its purpose, selection criteria, and deposition methods. (XV)
	16.	Identify common uses of oxidation, how it is done, and how it is evaluated. (XVI)
	17.	Describe the purpose and process of capacitance-voltage plotting. (XVII)
	18.	Explain the process and equipment used in photoresist application. (XVIII)
	19.	Describe the purpose and basic steps of photolithography. (XIX)
	20.	List two types of photoresists, their performance factors, and guidelines for their storage and handling. (XX)
	21.	Identify and write correct symbols and group numbers for elements using a periodic table. (XXI)
	22.	Interpret symbols and abbreviations commonly used in wafer fabrication. (XXII)
	23.	Compare conductors, insulators, and doped semi-conductors in terms of their valence band, availability of free electrons, width of forbidden zone, and relative energy required to excite. (XXIII)
	24.	Explain operation analysis and step analysis of a product produced in the fab. (XXIV)
	25.	Describe the purpose and process of resistivity and migration testing. (XXV)

7.	EVALUATION PROCEDURES:
	The student will be graded on his/her demonstrated skills at understanding and applying Advanced Semiconductor Manufacturing Process.
	You will be given laboratory assignments. These must be completed on time in order to receive full credit.
	Laboratory assignments	30%
	Quizzes and tests	20%
	Exams	40%
	Attitude, teamwork, and safety	10%
	Attendance is critical for completion of all assignments
	GRADING SCALE
	Raw Score Range	Letter Grade
	90 to 100	A
	80 to 89	B
	70 to 79	C
	In order to successfully complete this course, ALL SMT II assignments must be completed to a minimum grade of 70%. For the Intel program the student must achieve a minimum GPA of 3.0.
	During open lab time, students will have the opportunity to compare notes and discuss Semiconductor projects as a team with other students.

Special Remarks:
1.	Attendance: College policy states that students may be dropped from enrollment when absent 20% of the scheduled class meetings. If enrolled from the beginning of the term, 15 hours will usually constitute 20% of a four-credit semester course which meets five hours per week. Reinstatement procedures are described in the PCC catalog.
2.	Tardy Policy: A student who is late three times (enters classroom after the instructor has taken roll) will be charged with one full absence unless the student can provide valid reasons for one or more of these tardies.
3.	Assignments/Missed Exams: It is the student's responsibility, whether present or absent, to obtain all material presented and to complete all course assignments. If prior arrangements are made or extenuating circumstances exist, makeup of tests may be allowed. Late homework papers will not be accepted unless those same extenuating circumstances exist. Makeup of quizzes is to be at the instructor's discretion.

8.	COURSE OUTLINE:
9.	METHODS OF INSTRUCTION:
	To be successful in this course, students are expected to participate in discussions, readings, in-class writing, and peer review activities. The instructor may assign point values to such activities.
10.	ACADEMIC INTEGRITY:
	The very nature of higher education requires that students adhere to accepted standards of academic integrity. Therefore, Pueblo Community College has adopted a policy of academic conduct as described in the Student Handbook. Violation of academic integrity may be defined to include the following: cheating, plagiarism, falsification and fabrication, abuse of academic materials, complicity in academic dishonesty, and personal misrepresentation. It is the student’s responsibility to be aware of the behaviors that constitute academic dishonesty. Sanctions for violating the standards of academic integrity may include warning, probation, suspension, and/or failure of the course or assignment at the discretion of the instructor.
11.	ADA NOTICE:
	Students who have a documented disability may be eligible to receive accommodations for this class. Please contact the Disability Resources Center at 549-3446 for further information.